ELECTRONICS APPLICATIONS

IC CHIP

  • Material : Multilayered, copper
  • Application : Individual traceability
  • Code type : DM 16×16
  • Dimension : 1 mm
  • Features :
    • Marking depth < 100nm
    • FULL-STAMP NIR
    • <10 ns (one pulse)

MICRO Li-ion Batteries

  • Material : Molding compound
  • Application : Full traceablity
  • Code type : DM 12×12
  • Dimension : 1 mm
  • Features :
    • FULL-STAMP NIR
    • <10 ns (one pulse)

IC MOLDED COMPUND

  • Material : Molded compund 
  • Application : Individual traceability
  • Code type : DM 14×14
  • Dimension : 1 mm
  • Features :
    • FULL-STAMP NIR
    • <10 ns (one pulse)

FlexPC

  • Material : Polyamide
  • Application : Individual traceability
  • Code type : DM 16×16
  • Dimension : 1 mm
  • Features :
    • FULL-STAMP NIR
    • <10 ns (one pulse)

WAFER

  • Material : Silicon
  • Application : Individual traceability
  • Code type : DM 12×12
  • Dimension : 1.2 mm
  • Features :
    • FULL-STAMP special
    • USP laser NIR
    • <1ps (one pulse)

Power electronics package

  • Material : Zirconia ceramics
  • Application : Individual traceability
  • Code type : DM 14×14
  • Dimension : 1 mm
  • Features :
    • PIXEL-STAMP / Glass
    • <100ms

Others applications